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Plasma oxidation of metallic gadolinium deposited on silicon by high pressure sputtering as high permittivity dielectric

机译:高压溅射沉积在硅中金属钆的血浆氧化,高压溅射为高介电常数

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Gadolinium oxide thin films were deposited on Si by sputtering a metallic gadolinium target at high pressure followed by an in situ plasma oxidation. Different metal deposition times with the same oxidation conditions were studied. The deposition conditions were analyzed by means of glow discharge optical spectroscopy. The oxide films were characterized by X-ray photoelectron spectroscopy, high resolution transmission electron microscopy and Fourier transform infrared spectroscopy. The films resulted stoichiometric and amorphous. Metal-insulator-semiconductor structures were fabricated with two different metal gates: titanium and platinum. The devices were measured before and after temperature treatments in a forming gas atmosphere. The Ti gated devices scavenge the SiOx interlayer while the Pt ones show no metal reaction.
机译:通过在高压下溅射金属钆靶,然后原位等离子体氧化在Si上沉积氧化钆薄膜。研究了具有相同氧化条件的不同金属沉积时间。通过辉光放电光谱分析沉积条件。氧化膜的特征在于X射线光电子能谱,高分辨率透射电子显微镜和傅里叶变换红外光谱。薄膜导致化学计量和无定形。用两种不同的金属栅极制成金属 - 绝缘体 - 半导体结构:钛和铂。在形成气体气氛中的温度处理之前和之后测量装置。 Ti门控设备清除SiO X / INF>中间层,而PT ONE表示没有金属反应。

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