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Plasma oxidation of metallic gadolinium deposited on silicon by high pressure sputtering as high permittivity dielectric

机译:高压溅射沉积在硅上的金属g作为高介电常数电介质的等离子体氧化

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Gadolinium oxide thin films were deposited on Si by sputtering a metallic gadolinium target at high pressure followed by an in situ plasma oxidation. Different metal deposition times with the same oxidation conditions were studied. The deposition conditions were analyzed by means of glow discharge optical spectroscopy. The oxide films were characterized by X-ray photoelectron spectroscopy, high resolution transmission electron microscopy and Fourier transform infrared spectroscopy. The films resulted stoichiometric and amorphous. Metal-insulator-semiconductor structures were fabricated with two different metal gates: titanium and platinum. The devices were measured before and after temperature treatments in a forming gas atmosphere. The Ti gated devices scavenge the SiOx interlayer while the Pt ones show no metal reaction.
机译:通过在高压下溅射金属g靶,然后进行原位等离子体氧化,将氧化d薄膜沉积在Si上。研究了在相同氧化条件下不同的金属沉积时间。借助辉光放电光谱法分析沉积条件。通过X射线光电子能谱,高分辨率透射电子显微镜和傅里叶变换红外光谱对氧化物膜进行表征。膜产生化学计量的和无定形的。金属绝缘体-半导体结构是用两种不同的金属栅制成的:钛和铂。在形成气体气氛中在温度处理之前和之后测量装置。钛门控器件清除了SiO x 中间层,而Pt则没有金属反应。

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