首页> 外国专利> METHOD OF FORMING A SILICON-CONTAINING METAL-OXIDE GATE DIELECTRIC BY DEPOSITING A HIGH DIELECTRIC CONSTANT FILM ON A SILICON SUBSTRATE AND DIFFUSING SILICON FROM THE SUBSTRATE INTO THE HIGH DIELECTRIC CONSTANT FILM

METHOD OF FORMING A SILICON-CONTAINING METAL-OXIDE GATE DIELECTRIC BY DEPOSITING A HIGH DIELECTRIC CONSTANT FILM ON A SILICON SUBSTRATE AND DIFFUSING SILICON FROM THE SUBSTRATE INTO THE HIGH DIELECTRIC CONSTANT FILM

机译:通过在硅基体上沉积高介电常数膜并将硅从基体扩散到高介电常数膜中来形成含硅金属氧化物门极电介质的方法

摘要

A gate electrode is formed on a substrate via a gate insulating film. The gate insulating film includes a high dielectric constant film containing a metal, oxygen and hydrogen, and a lower barrier film formed below the high dielectric constant film and containing a metal, oxygen, silicon and nitrogen.
机译:栅电极经由栅绝缘膜形成在基板上。栅极绝缘膜包括包含金属,氧和氢的高介电常数膜,以及形成在该高介电常数膜下方并包含金属,氧,硅和氮的下阻挡膜。

著录项

  • 公开/公告号US6642131B2

    专利类型

  • 公开/公告日2003-11-04

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD.;

    申请/专利号US20020122366

  • 发明设计人 YOSHINAO HARADA;

    申请日2002-04-16

  • 分类号H01L213/205;H01L214/763;

  • 国家 US

  • 入库时间 2022-08-22 00:04:51

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