Image sensors for Web, PDA and Cellular Phones miniaturized video cameras are strongly affected by low yield during the assembly process. Using silicon through vias for electrical interconnections: a quite new technological platform at wafer level developed at ST (Cornaredo R&D site), it is possible to simplify the assembly process of several sensor devices. The proposed architecture allows the wafer protection during wafer dicing for singulation and then the possibility to have dangerous particles on the active surface is reduced. Moreover, this approach eliminates the active manual tuning of the optics currently performed during the final assembly process.
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