TOTAL PROCESS CONTROL AND MANAGEMENTFROM RELIABILITY, STABILITY, TRACEABILITY TO PREDICTABILITY (RSTP): A MODEL TO PERFORM PACKAGE AND SOLDER JOINT RELIABILITY STUDY, PROCESS QUALIFICATION, E-SPC MANUFACTURING, AND PREDICTION OF PRODUCT AND PROCESS QUALIT

摘要

To achieve Total Process Control and Management, thernRSTP (Reliability, Stability, Traceability and Predictability)rnmodel is proposed and implemented. This methodologyrnenables product developer to performrn(1) electronic package and solder joint reliability studyrn(product design stage),rn(2) Product process qualification (New ProductrnIntroduction stage),rn(3) e-SPC real-time monitoring manufacturing (massrnproduction stage),rn(4) prediction of process and product quality (asrnprojection function to close the loop)rnThe goal is to provide a streamline technical working modelrnand to facilitate the migration from product design,rnengineering and reliability verification, processrndevelopment and qualification, high yield manufacturing, tornprojection of future product and process quality.