表贴元件与双列直插器件温循过程中焊点可靠性研究

摘要

Study of surface mount resistance and through hole DIP device solder joint reliability. Analyze crack location and inlfuence factors via optics microscope and SEM after thermal cycling referring to ECSS criterion. The results show that cracks in DIP solder joint are located in interface of leader, solder and pad; and the thickness of PCB has no obvious inlfuence on reliability of joints. Cracks in surface mounting resistance solder joint are located in interface of the device and solder; and besides, the crack is longer for larger device.%研究了表贴电阻及插装DIP器件的焊点可靠性。参照ECSS相关标准对装联后表贴电阻及插装DIP进行温循试验，借助光学显微镜及SEM电镜分析焊点内裂纹位置及影响因素。结果表明，DIP焊点裂纹产生于焊料与引脚的焊点上圆角处以及焊料与焊盘界面拐角处，PCB厚度对裂纹长度影响不大。表贴电阻裂纹产生于电极与焊料界面拐角处及下界面处，器件尺寸越大裂纹尺寸越长。