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Method of making a self-aligned silicide contact using polysilicon electrode as an etch mask

机译:使用多晶硅电极作为蚀刻掩模进行自对准硅化物接触的方法

摘要

In fabricating the contact, the electrode layer of polycrystalline silicon whose rim portion is bonded via a layer portion of insulating material to the substrate, is used at least throughout the length of a part of its rim portion for the lateral delimitation of a etching process, as an etch mask, in the course of which a frame-shaped layer portion is formed underneath the rim portion of the electrode layer, and the contact area of the substrate as bordering on the layer portion is exposed. Following the deposition of a metal layer of a metal forming a silicide in a thickness smaller than the thickness of the layer portion, and the heating for forming the silicide, the metal which has so far not reacted with the silicon, is removed by using an etching agent selectively dissolving the metal.
机译:在制造接触时,多晶硅的电极层的边缘部分通过绝缘材料的层部分粘结到基板上,至少在其一部分边缘的整个长度上都用于横向划定蚀刻工艺,作为蚀刻掩模,在其过程中,在电极层的边缘部分下方形成框形层部分,并且暴露出与该层部分接壤的基板的接触区域。在沉积形成硅化物的金属的金属层的厚度小于层部分的厚度之后,并且通过加热形成硅化物的方式,使用硅化物去除迄今尚未与硅反应的金属。腐蚀剂选择性地溶解金属。

著录项

  • 公开/公告号US4882297A

    专利类型

  • 公开/公告日1989-11-21

    原文格式PDF

  • 申请/专利权人 DEUTSCHE ITT INDUSTRIES GMBH;

    申请/专利号US19880205589

  • 发明设计人 LOTHAR BLOSSFELD;

    申请日1988-06-13

  • 分类号H01L21/225;H01L21/283;H01L21/302;

  • 国家 US

  • 入库时间 2022-08-22 06:08:13

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