Semiconductor devices without flags and manufacturing method

摘要

The flagless semiconductor device 10 includes a semiconductor die 22 having a plurality of bond pads 26 electrically coupled to the plurality of leads 16 by wire bonds 28. The die is supported by two cantilevered tie bars 18. The use of cantilevered tie bars reduces the overall plastic-metal interface area in a plastic coated device, so there is less chance of internal cracking and package cracking. The cantilevered tie bar can also accommodate dies of various sizes for the same lead frame shape. The shape of the cantilever type tie bar is not limited to the U type, the T type and the H type.