Wafer for evaluating machining ability of wafer peripheral portion and method for evaluating machining capability of wafer periphery

摘要

In order to measure the in-plane distribution of the wafer peripheral processing capability, the wafer is used for evaluating the machining ability of the outer periphery of the wafer. The processing quantity of each part of the part is measured, and the in-plane distribution of the machining ability of the outer part is grasped and evaluated.