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Study on the subsurface damage depth in machined silicon wafers by the laser-ultrasonic method

机译：激光超声方法研究机加工硅片的表面损伤深度

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Karabutov A.A.; Podymova N.B.;
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年度 2014
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1. Laser optoacoustic method for quantitative nondestructive evaluation of the subsurface damage depth in ground silicon wafers [J] . N B Podymova, A A Karabutov, E B Cherepetskaya Laser Physics: An International Journal devoted to Theoretical and Experimental Laser Research and Application . 2014,第8期

机译：激光光声法定量评估无损硅晶圆表面损伤深度
2. Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process [J] . Zhang Lixiang, Chen Pei, An Tong, Current applied physics: the official journal of the Korean Physical Society . 2019,第5期

机译：自旋磨工艺引起的硅晶片地下损伤深度的分析预测
3. Quantitative assessment of subsurface damage depth in silicon wafers based on optical transmission properties [J] . J. M. Zhang, J. G. Sun International Journal of Manufacturing Technology and Management . 2005,第5a6期

机译：基于光传输特性的硅晶圆表面损伤深度的定量评估
4. Study on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond Wheel [C] . S. Gao, R. K. Kang, D. M. Guo, International Symposium on Advances in Abrasive Technology . 2010

机译：钻石轮硅晶片地下损伤分布研究
5. Surface and Subsurface Damages in Rotary Ultrasonic Machining of Ceramics: A Molecular Dynamics Method with Experimental Study [D] . Ahmed, Yasser Hamouda. 2019

机译：陶瓷旋转超声加工的表面和地下损伤：实验研究的分子动力学方法
6. Study on Damage Evaluation and Machinability of UD-CFRP for the Orthogonal Cutting Operation Using Scanning Acoustic Microscopy and the Finite Element Method [O] . Dongyao Wang, Xiaodong He, Zhonghai Xu, 2017

机译：UD-CFRP在正交切削加工中的损伤评价和切削性能的扫描声学显微镜和有限元研究
7. Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering [O] . Jingfei Yin, Qian Bai, Han Haitjema, 2020

机译：偏光激光散射硅晶片泥浆损伤的二维检测
8. Detection of subsurface defects in machined silicon nitride ceramics by optical scattering methods [R] . Ellingson, W. A., Ayaz, D. M., Brada, M. P., 1993

机译：用光学散射法检测机加工氮化硅陶瓷的亚表面缺陷

Study on the subsurface damage depth in machined silicon wafers by the laser-ultrasonic method

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