MARKING METHOD OF WAFER, MARKING METHOD OF THE NEXT ITEM DICE, POSITIONING METHOD OF WAFER, AND WAFER INSPECTION EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a marking method of a wafer.;SOLUTION: A wafer having at least two reference marks is provided. A plurality of dices are included on a surface of the wafer. A process for positioning the wafer by inspecting simultaneously the reference marks of the wafer is executed to mark the wafer with laser light beam. In addition, a method can be applied to marking of wafer dice, such as the next item dice or the like. Compared with a conventional technology of marking the next item dice in ink, the method suppresses contamination of the wafer, saves an operation time, contracts an office space, and has an advantage of permanent marking or the like, and what is more, has a characteristic of easily utilizing and improving the existing wafer inspection equipment or an existing printing equipment base.;COPYRIGHT: (C)2009,JPO&INPIT