METHOD FOR MARKING WAFER, METHOD FOR MARKING FAILED DIE, METHOD FOR ALIGNING WAFER AND WAFER TEST EQUIPMENT

摘要

The present invention relates to a wafer marking method, by including a plurality of die (die) on one surface, and inspecting the reference mark on the stage, the wafer to provide a wafer having at least two reference mark at the same time, the wafer by using a step of sorting, and the laser light with respect to a step of marking with respect to the wafer. The invention also as viewed, and is available even if the marking of the die, for example, bad die on the wafer, as compared with the conventional technique of ink marking with respect to the defective die, the present invention reduces the contamination of the wafer, the work and it has the advantage of being able to permanently marked, as well as be able to reduce workplace space. Also it has a feature that can be used to improve the conventional wafer inspection system or ink equipment.