METHOD FOR MARKING WAFER, METHOD FOR MARKING FAILED DIE, METHOD FOR ALIGNING WAFER AND WAFER TEST EQUIPMENT

摘要

The present invention provides a method for marking a wafer, which comprises steps of providing a wafer having a plurality of dies on a surface thereof and at least two reference marks, detecting the reference marks of the wafer simultaneously for aligning the wafer, and marking the wafer by laser radiation. The present invention also provides a method for marking failed dies of a wafer which, compared to conventional ink process for marking failed dies, is capable of preventing wafer pollution, and reducing process time and installation space.