机译:Study on precision dicing process of SiC wafer with diamond dicing blades
School of Mechanical Engineering Shenyang University of Technology Shenyang 110870 China;
School of Mechanical Engineering Shenyang University of Technology Shenyang 110870 China;
School of Mechanical Engineering Shenyang University of Technology Shenyang 110870 China;
School of Mechanical Engineering Shenyang University of Technology Shenyang 110870 China;
School of Mechanical Engineering Shenyang University of Technology Shenyang 110870 China;
Micro-dicing; Silicon carbide; Dicing blade; Dicing process; Diamond abrasive; Low-damage surface integrity;