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The AlGaN/GaN high high election mobility transistor and its production mannered null nitriding gallium which possess the gate contact on the GaN

机译:具有GaN栅极接触的AlGaN / GaN高高迁移率晶体管及其生产化的空氮化镓

摘要

And a method for fabricating a HEMT with high electron mobility transistor (HEMT). Gallium nitride (GaN) channel layer, a device according to an embodiment of the present invention comprises (AlGaN) barrier layer of aluminum gallium nitride on the channel layer. The form (18) source electrode by providing an ohmic contact to the first, to provide an ohmic contact of the second spaced apart from (18) the source electrode barrier layer (16) on the barrier layer (16) on I form a drain electrode (20) by. Barrier layer (16) on, I provided cap segment of the GaN-based (30) between the source electrode (18) and the drain electrode (20). Cap segment of the GaN-based (30), having first side wall (31) and spaced from the source electrode (18) next to the source electrode (18), next to the drain electrode (20) and the drain electrode ( and may have the second side wall (32) and spaced from 20). To form (22) gate contact by providing a non-ohmic contact cap segment of GaN-based (30) on. Gate contact (22) has a first side wall arranged in a substantially straight line (31) first side wall (30) segments of the GaN cap base (27). Gate contact (22), extends only to a portion between the second side wall (31) first side wall (30) segments of GaN cap base (32).
机译:以及一种用于制造具有高电子迁移率晶体管(HEMT)的HEMT的方法。氮化镓(GaN)沟道层,根据本发明实施方式的器件,在沟道层上包括氮化铝镓的(AlGaN)势垒层。通过向第一电极提供欧姆接触来形成(18)源电极,以在第二电极上与第二阻挡电极(16)上的源电极阻挡层(16)间隔开(18)来提供第二欧姆接触,从而形成漏极电极(20)。在阻挡层(16)上,我在源电极(18)和漏电极(20)之间提供了GaN基(30)的帽段。 GaN基(30)的帽段,具有第一侧壁(31),并且与源电极(18),源电极(18),漏电极(20)和漏电极(和可以具有第二侧壁(32)并且与第二侧壁(20)隔开。通过在其上提供GaN基(30)的非欧姆接触帽部分来形成(22)栅极接触。栅极触点(22)具有第一侧壁,该第一侧壁布置在GaN盖基(27)的第一侧壁(30)的基本直线段中。栅极触点(22)仅延伸到GaN盖基(32)的第二侧壁(31)和第一侧壁(30)之间的部分。

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