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SEMICONDUCTOR DEVICE HAVING AU-CU ELECTRODES, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

机译:具有au-cu电极的半导体装置及其制造方法

摘要

A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed.
机译:一种制造生物传感器半导体器件的方法,其中将器件主表面上的铜电极改性以形成Au-Cu合金电极。通过在器件上沉积金层,然后对器件进行热处理以促进金与电极铜之间的相互扩散来实现这种修饰。从设备表面去除合金化的金铜,留下裸露的电极。与传统的铜电极相比,该电极与生物传感器装置的进一步处理具有更好的兼容性,并且处理窗口比金盖的铜电极宽。还公开了具有Au-Cu合金电极的生物传感器半导体器件。

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