Semiconductor device having Au-Cu electrodes and method of manufacturing semiconductor device

摘要

A method of manufacturing a biosensor semiconductor device is disclosed, in which copper electrodes at the major surface of the semiconductor devices are modified to form Au-Cu alloy electrodes. The modification is effected by depositing, typically by sputtering, a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper and to alloy them. The alloyed gold-copper is removed from the surface of the device typically by CMP, leaving the exposed electrodes. Since the gold-copper alloy is harder than gold, the CMP process window is wider than would be the case of pure gold; moreover, since the electrode copper has been converted to a gold-copper alloy, it is more corrosion resistant than a conventional copper electrode. The electrodes are thus better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes.;A biosensor semiconductor device having Au-Cu alloy electrodes is also disclosed.