The invention provides a package substrate having a via hole medium layer embedded therein and a method of forming same, the substrate comprising a mold-sealing layer, a via hole medium layer formed with conductive via holes and embedded into the mold-sealing layer, a circuit re-distribution layer embedded in the mold-sealing layer and disposed on the via hole medium layer and electrically connected to either end surfaces of the conductive via holes, and a build-up layer disposed on the mold-sealing layer and the via hole medium layer and electrically connected to the other end surfaces of the conductive via holes. By embedding the via hole medium layer, the circuit redistribution layer can be electrically connected to electrode pads having smaller spacing therebetween that are formed on a semiconductor chip, while another end is connected to conductive blind via holes having larger spacing therebetween that are formed on the build-up layer, thereby allowing the package substrate to bond with the semiconductor chip having high density wiring formed thereon. The invention further provides a method for forming the package substrate as described above.
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