机译:玻璃中介层和封装中的细间距通孔的可靠性,可用于高带宽计算和通信
Packaging Research Center, Georgia Institute of Technology;
Packaging Research Center, Georgia Institute of Technology;
Asahi Glass Co;
Universite Internationale de Rabat;
Packaging Research Center, Georgia Institute of Technology;
Packaging Research Center, Georgia Institute of Technology;
Packaging Research Center, Georgia Institute of Technology;
Packaging Research Center, Georgia Institute of Technology;
Packaging Research Center, Georgia Institute of Technology;
机译:玻璃纤维增强的无卤环氧基板中的细间距通孔的绝缘可靠性
机译:通过高通孔率工艺实现具有高纵横比,细间距贯穿封装的玻璃中介层的铜金属化
机译:有机封装基板中细间距通孔互连中的导电阳极丝故障
机译:薄玻璃中介层和封装中的细间距贯穿封装铜通孔(TPV)的热机械和电化学可靠性
机译:基于中介层的3-D封装的全面制造和可靠性研究
机译:锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
机译:用于细间距晶圆级封装的电气测试的中介层的仿真和制造