PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD OF PRINTED CIRCUIT SUBSTRATE USING THE SAME, AND ITS PRODUCTION METHODS

摘要

PROBLEM TO BE SOLVED: To provide a novel pretreatment agent for electroless plating, which is excellent in adhesion of insulation resin substrate and a plating film, foamability resistance by suppressing foam generation in short time, and penetrability to the insulation substrate.SOLUTION: The pretreatment agent for electroless plating of the invention includes: fluorine compound; surface active agent; ethylene-based glycol butyl ether expressed by CH-(OCH)n-OH (n=an integer 1 to 4) and/or propylene-based glycol butyl ether expressed by CH-(OCH)n-OH(n=an integer 1 to 4).