Pretreatment agent for electroless plating, pretreatment method for printed wiring board using pretreatment agent for electroless plating, and production method thereof

摘要

A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.