PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED

摘要

A pretreatment agent for electroless plating is provided, which includes: a silane coupling agent; a surfactant; and ethylene-based glycol butyl ethers of formula: C 4 H 9 -(OC 2 H 4 ) n -OH where n is an integer of 1 to 4, and/or propylene-based glycol butyl ethers of formula: C 4 H 9 -(OC 3 H 6 ) n -OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.