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PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED
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机译:使用无电镀液预处理剂的电镀前处理剂,印制线路板的预处理方法和制造方法
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摘要
A pretreatment agent for electroless plating is provided, which includes: a silane coupling agent; a surfactant; and ethylene-based glycol butyl ethers of formula: C4H9-(OC2H4)n-OH where n is an integer of 1 to 4, and/or propylene-based glycol butyl ethers of formula: C4H9-(OC3H6)n-OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
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机译:提供一种用于化学镀的预处理剂,其包括:硅烷偶联剂;和表面活性剂;和式C 4 Sub> H 9 Sub>-(OC 2 Sub> H 4 Sub>)的乙烯基乙二醇丁醚< Sub> n Sub> -OH,其中n为1至4的整数,和/或基于丙烯的乙二醇丁基醚,其式为:C 4 Sub> H 9 Sub>- (OC 3 Sub> H 6 Sub>) n Sub> -OH,其中,n为1到4的整数。用于印刷线路板的印刷电路板和用于制造印刷线路板的方法均包括使用如上所述的用于化学镀的预处理剂。
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