PRETREATMENT LIQUID FOR ELECTROLESS NICKEL PLATING, PRETREATMENT METHOD TO ELECTROLESS NICKEL PLATING, ELECTROLESS NICKEL PLATING METHOD, AND METHOD FOR PRODUCING PRINT CIRCUIT BOARD AND SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a pretreatment liquid for electroless nickel plating where the generation of bridges can be sufficiently prevented even in the case a lead ion-free electroless nickel plating liquid is used; to provide a pretreatment method to electroless nickel plating; to provide an electroless nickel plating method; and to provide a method for producing a printed circuit board and a substrate for mounting a semiconductor chip.;SOLUTION: The pretreatment liquid for electroless nickel plating comprises at least one kind of sulfur compound selected from specified aliphatic thiol compounds and disulfide compounds, and an organic solvent(s). The total content of the sulfur compound(s) in the pretreatment liquid is 0.0005 to 10 g/L, and also, the ratio (X/Y) between the total content X(mL/L) of the organic solvent(s) in the pretreatment liquid and the total content Y(g/L) of the sulfur compound(s) in the pretreatment liquid is 80,000. The pretreatment liquid is contacted with the surface of a substrate for mounting a semiconductor chip having copper wiring, and electroless nickel plating is applied to the surface of the copper wiring.;COPYRIGHT: (C)2007,JPO&INPIT