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PRETREATMENT LIQUID FOR ELECTROLESS NICKEL PLATING, AND PRETREATMENT METHOD TO ELECTROLESS NICKEL PLATING
PRETREATMENT LIQUID FOR ELECTROLESS NICKEL PLATING, AND PRETREATMENT METHOD TO ELECTROLESS NICKEL PLATING
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机译:化学镀镍的预处理液及化学镀镍的预处理方法
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摘要
PROBLEM TO BE SOLVED: To provide a pretreatment liquid for electroless nickel plating where the generation of the abnormal precipitation of electroless nickel plating is reduced to a sufficient level.;SOLUTION: The pretreatment liquid for electroless nickel plating comprises a heterocyclic compound containing sulfur atoms in the molecule and an organic solvent. In the heterocyclic compound, the concentration is 0.0005 to 3 g/L based on the total volume of the pretreatment liquid for electroless nickel plating, and, provided that the concentration of the heterocyclic compound is defined as MA(g/L), the concentration of the organic solvent is 5×MA to 5,000×MA mL/L based on the total volume of the pretreatment liquid for electroless nickel plating.;COPYRIGHT: (C)2007,JPO&INPIT
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机译:解决的问题:提供一种用于化学镀镍的预处理液,其中化学镀镍的异常沉淀的产生减少到足够的水平。分子和有机溶剂。在该杂环化合物中,基于用于化学镀镍的预处理液的总体积,浓度为0.0005至3g / L,并且前提是将杂环化合物的浓度定义为M A Sub> (g / L),基于预处理液的总体积,有机溶剂的浓度为5×M A Sub>至5,000×M A Sub> mL / L化学镀镍;版权所有:(C)2007,日本特许经营&INPIT
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