首页> 外国专利> PRETREATMENT LIQUID FOR ELECTROLESS NICKEL PLATING, AND PRETREATMENT METHOD TO ELECTROLESS NICKEL PLATING

PRETREATMENT LIQUID FOR ELECTROLESS NICKEL PLATING, AND PRETREATMENT METHOD TO ELECTROLESS NICKEL PLATING

机译:化学镀镍的预处理液及化学镀镍的预处理方法

摘要

PROBLEM TO BE SOLVED: To provide a pretreatment liquid for electroless nickel plating where the generation of the abnormal precipitation of electroless nickel plating is reduced to a sufficient level.;SOLUTION: The pretreatment liquid for electroless nickel plating comprises a heterocyclic compound containing sulfur atoms in the molecule and an organic solvent. In the heterocyclic compound, the concentration is 0.0005 to 3 g/L based on the total volume of the pretreatment liquid for electroless nickel plating, and, provided that the concentration of the heterocyclic compound is defined as MA(g/L), the concentration of the organic solvent is 5×MA to 5,000×MA mL/L based on the total volume of the pretreatment liquid for electroless nickel plating.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种用于化学镀镍的预处理液,其中化学镀镍的异常沉淀的产生减少到足够的水平。分子和有机溶剂。在该杂环化合物中,基于用于化学镀镍的预处理液的总体积,浓度为0.0005至3g / L,并且前提是将杂环化合物的浓度定义为M A (g / L),基于预处理液的总体积,有机溶剂的浓度为5×M A 至5,000×M A mL / L化学镀镍;版权所有:(C)2007,日本特许经营&INPIT

著录项

  • 公开/公告号JP2006316350A

    专利类型

  • 公开/公告日2006-11-24

    原文格式PDF

  • 申请/专利权人 HITACHI CHEM CO LTD;

    申请/专利号JP20060111259

  • 申请日2006-04-13

  • 分类号C23C18/18;C23C18/20;H05K3/18;H01L21/288;H01L21/28;H01L21/60;H01L23/12;

  • 国家 JP

  • 入库时间 2022-08-21 21:11:55

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