MANUFACTURING METHOD OF DICING SHEET, DICING/DIE-BONDING FILM, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a dicing sheet and a dicing/die-bonding film, capable of removing slack of a dicing sheet and preventing contact between semiconductor elements.;SOLUTION: The dicing sheet is contracted by being heated at 100°C for one minute, so a second length in an MD direction after heating relative to a first length 100% in the MD direction before heating is less than or equal to 95%. The dicing sheet includes: a substrate; and an adhesive layer disposed on the substrate. The dicing/die-bonding film includes: the dicing sheet; and a bonding layer disposed on the adhesive layer.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2016,JPO&INPIT