DICING DIE-BONDING FILM, MANUFACTURING METHOD OF DICING DIE-BONDING FILM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a dicing die-bonding film which can enhance detachability at the time of pickup while maintaining holding force at the time of dicing, and can minimize detachment of the dicing die-bonding film from a dicing ring.SOLUTION: An adhesive layer contains a polymer obtained by addition reaction of a specific isocyanate compound to a specific acrylic polymer, and a specific crosslinking agent. A specific peeling adhesion at a part of the adhesive layer where a dicing ring is pasted is 1.0-10.0 N/20 mm tape width, and a tensile storage modulus at the part where the dicing ring is pasted is 0.05-0.4 MPa at 23°C. A die-bonding film is pasted to the adhesive layer after being irradiated with UV-rays.