Patent Issued for Bonding Film Composition for Semiconductor Assembly, Bonding Film Therefrom, and Dicing Die Bond Film Comprising the Same

摘要

2013 MAR 27 (VerticalNews) -- By a News Reporter-Staff News Editor at Journal of Engineering -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Hong, Yong Woo (Suwon-si, KR); Im, Su Mi (Uiwang-si, KR); Kim, Wan Jung (Suwon-si, KR); Jung, Ki Sung (Gunpo-si, KR); Chung, Chang Beom (Yongin-si, KR), filed on July 19, 2007, was cleared and issued on March 12, 2013.