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BONDING FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY, BONDING FILM THEREFROM, AND DICING DIE BOND FILM COMPRISING THE SAME
BONDING FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY, BONDING FILM THEREFROM, AND DICING DIE BOND FILM COMPRISING THE SAME
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机译:半导体组件的键合膜成分,键合胶片的前导膜和由相同的管芯模切膜组成
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摘要
An adhesive film composition for the assembly of a semiconductor is provided to increase the releasing of an adhesive film for preventing the fixation between films and to lower peel strength. An adhesive film composition for the assembly of a semiconductor comprises the modified silicone oil represented by the formula 1, an elastomeric resin containing a hydroxyl group or a carboxy group, a thermoplastic resin, an epoxy-based resin, a phenol curing agent, a curing catalyst, a silane coupling agent and a filler.
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