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Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same
Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same
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机译:用于半导体组件的接合膜组合物,由其形成的接合膜以及包括该接合膜组合物的切割芯片接合膜
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摘要
A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
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