Integrated circuit package having wire bonded multi-die stack

摘要

Embodiments of the present disclosure provide an integrated circuit (IC) package that includes a first die that is at least partially embedded in a first encapsulation layer and a second die that is at least partially embedded in a second encapsulation layer. Directed to. The first die may have a first plurality of die level interconnect structures disposed on the first side of the first sealing layer. The IC package is also at least partially embedded in the first sealing layer and configured to send an electrical signal between the first side and the second side of the first sealing layer. A plurality of electrical routing functions may be included. The second side can be disposed on the opposite side of the first side. The second die can have a second plurality of die level interconnect structures that can be electrically coupled to at least a subset of the plurality of electrical routing features by bonding wires.