THREE-DIMENSIONAL INTEGRATED CIRCUIT ASSEMBLY WITH ACTIVE INTERPOSER

摘要

Embodiments of the disclosure relate to a three-dimensional (3D) integrated circuit (IC) (3DIC) assembly with active interposer. The 3DIC assembly includes an antenna substrate having at least one electromagnetic radiating structure (e.g., an antenna) and a carrier substrate having layered conductive interconnects. An active interposer(s) is formed by a semiconductor IC chip(s) and disposed between the antenna substrate and the carrier substrate to conductively couple the antenna substrate with the carrier substrate. The active interposer is coupled to the electromagnetic radiating structure in the antenna substrate through a conductive path that penetrates the antenna substrate, but not going through the carrier substrate. As such, it is possible to reduce routing distance between the active interposer and the electromagnetic radiating structure, thus helping to reduce path loss and/or electromagnetic signal interference to improve heat dissipation and power consumption of the 3DIC assembly.