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机译:表面张力驱动的芯片自组装,在室温下无负载的氟化氢辅助直接键合,用于三维集成电路
Department of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku,Sendai 980-8579, Japan;
rnDepartment of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku,Sendai 980-8579, Japan;
rnDepartment of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku,Sendai 980-8579, Japan;
rnDepartment of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku,Sendai 980-8579, Japan;
rnDepartment of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku,Sendai 980-8579, Japan;
rnMedical Nanosystem Engineering Laboratory, Tohoku University, 6-6 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan;
rnDepartment of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku,Sendai 980-8579, Japan;
机译:由低温Cu / Sn-Cu键形成的用于三维集成电路的高密度大面积阵列互连
机译:由分子间氢键和弱相互作用引导的新硫脲衍生物的超分子自组装:晶体结构和HIRSHFELD表面分析
机译:使用硬片上系统优化部分堆叠/完整堆叠的三维堆叠集成电路中的测试架构
机译:利用低温直接键合技术为CMOS图像传感器开发集成电路的新型三维结构
机译:氢键引导的寡聚分子链自组装和氢介导的铑催化的1,6-烯炔的还原环化反应。
机译:超分子化学和自组装特殊功能:由NH⋅⋅⋅O氢键引导的自组装:衍生自的新分层分子阵列4-叔丁基苯甲酸和脂肪族二胺
机译:半导体芯片的表面张力定向流体自组装跨越长度尺度和材料边界