3 3 CHIP SUPPORT SUBSTRATE METHOD FOR SUPPORTING CHIP THREE-DIMENSIONAL INTEGRATED CIRCUIT ASSEMBLY DEVICE AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT

摘要

The present invention relates to a liquid crystal display device comprising a lyophilic area (4) formed on a substrate and absorbing a chip (3A), and an electrode (6) formed on the substrate and in the lyophilic area, , And a chip supporting substrate. A step of disposing a chip via a liquid (15) on the lyophilic area formed on the substrate and the lyophilic area of the chip supporting substrate having the electrode formed on the substrate and in the lyophilic area; And generating an electrostatic force in a chip corresponding to the electrode by applying a voltage.