机译:具有超薄芯片堆叠的三维集成电路集成的组装技术开发和故障分析
Chung Yuan Christian Univ, Dept Mech Engn, 200 Chung Pei Rd, Taoyuan 32023, Taiwan;
Ind Technol Res Inst, Elect & Optoelect Res Labs, Stacking & Reliabil Technol Dept 3D, 195 Sec 4,Chung Hsing Rd, Hsinchu 31040, Taiwan;
Natl Taiwan Univ, Dept Mech Engn, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan;
Chung Yuan Christian Univ, Dept Mech Engn, 200 Chung Pei Rd, Taoyuan 32023, Taiwan;
Ind Technol Res Inst, Elect & Optoelect Res Labs, Stacking & Reliabil Technol Dept 3D, 195 Sec 4,Chung Hsing Rd, Hsinchu 31040, Taiwan;
Ind Technol Res Inst, Elect & Optoelect Res Labs, Stacking & Reliabil Technol Dept 3D, 195 Sec 4,Chung Hsing Rd, Hsinchu 31040, Taiwan;
Chung Yuan Christian Univ, Dept Mech Engn, 200 Chung Pei Rd, Taoyuan 32023, Taiwan;
3D-ICs; Ultra-thin chip; Microbump; FEA; Packaging;
机译:使用硬片上系统优化部分堆叠/完整堆叠的三维堆叠集成电路中的测试架构
机译:三维集成电路封装,三维硅集成和三维集成电路集成的概述和展望
机译:表面张力驱动的芯片自组装,在室温下无负载的氟化氢辅助直接键合,用于三维集成电路
机译:使用预成型技术进行超薄芯片堆叠的制造,组装和故障评估
机译:在三维堆叠集成电路中检测特洛伊木马模具
机译:朝向芯片上光相干断层扫描:在使用基于光子集成电路的阵列波导光栅的体内三维人视线成像
机译:超薄芯片封装(UTCp)和弹性电路技术,适用于紧凑或舒适的传感器和电子组件
机译:用于原型微电子集成电路的芯片和线材组装和封装设备,