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Device Physics Research for Submicron and Deep Submicron Space Microelectronics Devices and Integrated Circuits

机译:亚微米和深亚微电子微电子设备和集成电路的设备物理研究

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Device physics research for submicron and deep submicron space microelectronics devicesand integrated circuits will be described in three topics. 1. Thin film submicron and deep submicron SOS / CMOS devices and integrated circuits. 2. Deep submicron LDD CMOS devices and integrated circuits. 3. C band and Ku band microwave GaAs MESFET and Ⅲ-V compound hetrojunctionHEMT and HBT devices and integrated circuits.1. Thin Film Submicron and Deep Submicron SOS / CMOS Devices and Integrated Cir-cuitsBy making use of the total quantity of carriers method, we have analyzed in details the be-havior of thin film (0.06-0.2μm) SOS/ MOS structure. This is the foundation for devicephysics of thin film SOI / MOSFET devices and integrated circuits.
机译:亚微米和深度亚微电子微电子器件的设备物理研究将在三个主题中描述集成电路。 1.薄膜亚微米和深亚微米SOS / CMOS器件和集成电路。 2.深亚微米LDD CMOS器件和集成电路。 3. C频段和KU频段微波Gaas Mesfet和Ⅲ-V复合Hetroj功能和HBT器件和集成电路。薄膜亚微米和深亚微米SOS / CMOS器件和集成的CIR-CUITSBY采用载体方法的总量,我们已经分析了细节薄膜的靠背(0.06-0.2μm)SOS / MOS结构。这是薄膜SOI / MOSFET器件和集成电路的陶器物理学的基础。

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