Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit

摘要

The present invention relates to a chip support substrate including a lyophilic region 4 that is formed on the substrate and that absorbs a chip 3A, and an electrode 6 that is formed on the substrate and in the lyophilic region and that generates electrostatic force in the chip, and to a chip support method including the steps of arranging the chip onto the lyophilic region of the chip support substrate with a liquid 15, the chip support substrate comprising the lyophilic region that is formed on the substrate, and the electrode that is formed on the substrate and in the lyophilic region, and generating the electrostatic force in the chip corresponding to the electrode by applying a voltage to the electrode.