METHOD FOR INTERCONNECTING ULTRA-FINE PITCH SEMICONDUCTOR CHIP TO SUBSTRATES USING THIN FILM METALLIZATION

摘要

Provided is an electrical connection method between an ultra-fine pitch semiconductor chip and a polymer substrate using a thin film metallization process. According to an embodiment, the electrical connection method between a semiconductor chip and a polymer substrate using a thin film metallization process performs a thin film metallization process to form a hole in a polymer substrate to insert a semiconductor chip into the polymer substrate or mold the semiconductor chip and connect an electrode of the exposed semiconductor chip to an electrode of the polymer substrate.