首页> 外国专利> Method for fabricating semiconductor thin film using substrate irradiated with focused light, apparatus for fabricating semiconductor thin film using substrate irradiated with focused light, method for selectively growing semiconductor thin film using substrate irradiated with focused light, and semiconductor element using substrate irradiated with focused light

Method for fabricating semiconductor thin film using substrate irradiated with focused light, apparatus for fabricating semiconductor thin film using substrate irradiated with focused light, method for selectively growing semiconductor thin film using substrate irradiated with focused light, and semiconductor element using substrate irradiated with focused light

机译:使用聚焦光照射的基板制造半导体薄膜的方法,使用聚焦光照射的基板制造半导体薄膜的装置,使用聚焦光照射的基板选择性地生长半导体薄膜的方法以及使用聚焦光照射的基板的半导体元件

摘要

An apparatus (100) for fabricating a semiconductor thin film includes: substrate surface pretreatment means (101) for pretreating a surface of a substrate; organic layer coating means (102) for coating, with an organic layer, the substrate thus pretreated; focused light irradiation means (103) for irradiating, with focused light, the substrate coated with the organic layer, and for forming a growth-mask layer while controlling layer thickness; first thin film growth means (104) for selectively growing a semiconductor thin film over an area around the growth-mask layer; substrate surface treatment means (105) for, after exposing the surface of the substrate by removing the growth-mask layer, modifying the exposed surface of the substrate; and second thin film growth means (106) for further growing the semiconductor thin film and growing a semiconductor thin film over the modified surface of the substrate.
机译:用于制造半导体薄膜的设备( 100 )包括:用于对衬底的表面进行预处理的衬底表面预处理装置( 101 );以及有机层涂覆装置( 102 ),用于用有机层涂覆经过预处理的基材;聚焦光照射装置( 103 ),用聚焦光照射涂覆有有机层的基板,并在控制层厚的同时形成生长掩模层。第一薄膜生长装置( 104 ),用于在生长掩模层周围的区域上选择性地生长半导体薄膜;基板表面处理装置( 105 ),用于在通过去除生长掩模层使基板表面暴露之后,对基板的暴露表面进行改性;第二薄膜生长装置( 106 )用于进一步生长半导体薄膜并在衬底的改性表面上生长半导体薄膜。

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