METHOD FOR INTERCONNECTING ULTRA-FINE PITCH SEMICONDUCTOR CHIP TO SUBSTRATES USING THIN FILM METALLIZATION

摘要

An electrical connection method between a micro-pitch semiconductor chip and a polymer substrate using a metal thin film process is presented. A method of electrically connecting a semiconductor chip and a polymer substrate using a metal thin film process according to an embodiment includes forming a hole in a polymer substrate to insert or mold a semiconductor chip therein, A thin film metallization process may be performed to connect the electrode and the electrode of the polymer substrate.