Optoelectronic structural element with a semiconductor body, including a substrate, a layer system deposited on the substrate and a metallized carrier useful in thin film, Flip-Chip and semiconductor technology

摘要

Optoelectronic structural element with a semiconductor body (SCB) (1), including a substrate (2) and a layer system (3) deposited on the substrate, where the SCB is fixed to a carrier (4) with the main surface opposite the substrate by a solder bond (7) and the carrier (4) is metallized with silver-free metal on the side opposite the SCB.