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NON-PLANAR INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN TRENCH CONTACT SPACING

机译:具有非对称源和漏极沟槽接触间距的非平面集成电路结构

摘要

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication. In an example, an integrated circuit structure includes a fin including silicon. A gate structure is over the fin, the gate structure having a center. A conductive source trench contact is over the fin, the conductive source trench contact having a center spaced apart from the center of the gate structure by a first distance. A conductive drain trench contact is over the fin, the conductive drain trench contact having a center spaced apart from the center of the gate structure by a second distance, the second distance greater than the first distance by a factor of three.
机译:本公开的实施例在高级集成电路结构制造领域中。在一示例中,集成电路结构包括包含硅的鳍。栅极结构在鳍上方,该栅极结构具有中心。导电源极沟槽触点在鳍片上方,该导电源极沟槽触点具有与栅极结构的中心间隔开第一距离的中心。导电漏极沟槽接触件在鳍片上方,该导电漏极沟槽接触件的中心与栅极结构的中心间隔开第二距离,第二距离比第一距离大三倍。

著录项

  • 公开/公告号US2020243655A1

    专利类型

  • 公开/公告日2020-07-30

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US201916260600

  • 申请日2019-01-29

  • 分类号H01L29/417;H01L29/66;H01L29/78;H01L29/06;H01L29/08;H01L27/12;H01L27/088;

  • 国家 US

  • 入库时间 2022-08-21 11:21:39

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