WAFER BACKSIDE CLEANING APPARATUS AND METHOD OF CLEANING WAFER BACKSIDE

摘要

A wafer cleaning and polishing pad includes a pad having a polishing surface, wherein the polishing surface includes a first material having a Shore D hardness ranging from 50 to 80 and a static coefficient of friction ranging from 0.01 to 0.6. The first material is a fluoropolymer. The pad includes a middle layer and/or a base under the polishing surface. The base includes a second material and the middle layer includes a third material having a lower surface hardness and a higher coefficient of friction than the first material. The polishing surface includes a plurality of grooves with varying groove depth from center of the pad to an edge of the pad.