Wafer Cleaning and Pre-Bonding Module for Wafer Bonding

摘要

The EVG 810 system was delivered to UCSB and installed in the new Engineering Sciences cleanroom. The machine was inspected and checked out to insure that it met the designed specifications for bond strength. A number of silicon wafers were bonded with and without activation. As designed, the silicon wafers bonded with an energy of approximately 1.5 J/m2 when activated versus 0.4 J/m2 without activation. The bulk fracture strength of silicon is approximately 2.5 J/m2.