首页> 外国专利> TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

机译:沟槽式硬质哈密尔顿用于高级集成电路结构制造

摘要

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin comprising silicon. A plurality of gate structures is over the fin, individual ones of the plurality of gate structures along a direction orthogonal to the fin and having a pair of dielectric sidewall spacers. A trench contact structure is over the fin and directly between the dielectric sidewalls spacers of a first pair of the plurality of gate structures. A contact plug is over the fin and directly between the dielectric sidewalls spacers of a second pair of the plurality of gate structures, the contact plug comprising a lower dielectric material and an upper hardmask material.
机译:本公开的实施例在高级集成电路结构制造领域中,尤其是在10纳米节点和较小的集成电路结构制造以及所得到的结构领域中。在一示例中,集成电路结构包括包含硅的鳍。多个栅极结构在鳍片上方,多个栅极结构中的各个栅极结构沿着与鳍片正交的方向并且具有一对介电侧壁间隔物。沟槽接触结构在鳍上方并且直接在多个栅极结构的第一对的电介质侧壁间隔物之间​​。接触塞在鳍片上方并且直接在多个栅极结构的第二对的电介质侧壁间隔物之间​​,该接触塞包括下部电介质材料和上部硬掩模材料。

著录项

  • 公开/公告号US2020286792A1

    专利类型

  • 公开/公告日2020-09-10

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US202016881514

  • 申请日2020-05-22

  • 分类号H01L21/8234;H01L49/02;H01L21/762;H01L21/8238;H01L21/311;H01L29/08;H01L27/11;H01L29/78;H01L29/66;H01L21/308;H01L27/092;H01L29/51;H01L21/285;H01L21/28;H01L21/033;H01L21/768;H01L23/532;H01L23/522;H01L23/528;H01L29/417;H01L27/088;

  • 国家 US

  • 入库时间 2022-08-21 11:20:02

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