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Experimental and mechanical characterizations of a lead free solder alloy for electronic devices

机译:电子设备用无铅焊料合金的实验和机械特性

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摘要

Electronic power modules devices are paramount components in the aeronautical,automotive and military applications. The solder layers are the most critical parts of the module and are usually subjected in their whole life to complex loading conditions. To improve the design task, realistic thermoelastoviscoplastic and lifetime prediction models which can describe efficiently the deformation-damage of the electrical device must be chosen carefully. Some of the most common behavior models are based on the separation between creep and plasticity deformations such as power law, Garofalo, Darveaux… So, to take into account the creep-plasticity interaction, the thermal cycling as well as the hardening-softening effects, unified viscoplastic models are increasingly being used to describe more efficiently the physical state of the material. We propose in this framework a survey of some unified viscoplastic models used in the electronic applications for the viscoplastic modeling of the solder as well as creep-fatigue life prediction rules. The models are used for the characterization of a SnAgCu solder and are briefly compared within tensile, creep data and stabilized responses.
机译:电子功率模块设备是航空,汽车和军事应用中的重要组件。焊料层是模块中最关键的部分,通常在其整个生命周期内都要经受复杂的负载条件。为了改善设计任务,必须仔细选择可以有效描述电气设备变形破坏的现实的热弹塑性和寿命预测模型。一些最常见的行为模型基于蠕变和塑性变形之间的分离,例如幂律,Garafalo,Darveaux等。因此,要考虑蠕变-塑性相互作用,热循环以及硬化-软化效果,越来越多地使用统一的粘塑性模型来更有效地描述材料的物理状态。我们在此框架中建议对一些用于电子应用的统一粘塑性模型进行调查,以用于焊料的粘塑性建模以及蠕变疲劳寿命预测规则。该模型用于表征SnAgCu焊料,并在拉伸,蠕变数据和稳定响应中进行了简要比较。

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