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Bonding of Mold Resin to Copper Substrate through an Amorphous Interlayer Film

机译：通过无定形层间膜将模塑树脂与铜基板的粘合

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Yuka YAMADA; Takashi ISEKI;
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1. Deposition of hydrogenated amorphous carbon films with enhanced sp~3 -C bonding on nanocrystalline palladium interlayer [J] . M. Roy, Kunal Mali, Niraj Joshi Diamond and Related Materials . 2007,第3期

机译：在纳米晶钯中间层上沉积具有增强的sp〜3-C键的氢化非晶碳膜
2. ENHANCEMENT OF ADHESION STRENGTH AND TRIBOLOGICAL PERFORMANCE OF CVD DIAMOND FILMS ON TUNGSTEN CARBIDE SUBSTRATES WITH HIGH COBALT CONTENT VIA AMORPHOUS SiC INTERLAYERS [J] . He Yuanping, Cui Yu-Xiao, Sun Fang-Hong Surface review and letters . 2019,第9期

机译：通过无定形SiC夹层具有高钴含量的碳化钨基材上CVD金刚石膜的粘附强度和摩擦学性能的增强
3. SIMULATION AND EXPERIMENTAL RESEARCH ON ADHESION ENHANCEMENT BETWEEN DIAMOND FILMS AND WC-Co SUBSTRATES BY EMPLOYING AMORPHOUS SiC INTERLAYER [J] . Cui Yu-Xiao, Sun Fang-Hong Surface review and letters . 2019,第6期

机译：采用无定形SIC层间模拟薄膜和WC-CO衬底粘附增强的模拟与实验研究
4. EFFECTS OF INTERLAYER RESIN BONDING ON FATIGUE CRACK INITIATION/PROPAGATION IN LAMINATE MATERIALS WITH A SURFACE LAYER OF COPPER FILM [C] . Akira Matsuba, Tashiyuki Torii, DongHui Ma Advances in Electronic Packaging 2005 pt.C . 2005

机译：层间树脂键合对铜膜表面层合材料疲劳裂纹萌生/扩展的影响
5. Film-substrate interactions in yttrium(1) barium(2) copper(3) oxygen(7-x) superconductor thin films deposited on oxide and alkaline earth fluoride substrates. [D] . Peters, Christopher Harry. 1993

机译：钇（1）钡（2）铜（3）氧（7-x）超导体薄膜中的膜-基底相互作用，沉积在氧化物和碱土金属氟化物基底上。
6. Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers [O] . D. Schäfer, C. Eisenmenger-Sittner, Mihai Chirtoc, -1

机译：硼基中间层修饰的碳基材上铜膜的机械和热界面的表征
7. Deposition of hydrogenated amorphous carbon films with enhanced sp3-C bonding on nanocrystalline palladium interlayer [O] . ROY MAINAK, MALI KUNAL, JOSHI NIRAJ, 2007

机译：在纳米晶钯中间层上沉积具有增强的sp3-C键的氢化非晶碳膜
8. Effects of interlayers on the scratch adhesion performance of ultra-thin films of copper and gold on silicon substrates [R] . McAdams, S. D., Tsui, T. Y., Pharr, G. M., 1995

机译：中间层对硅基板上超薄铜，金薄膜划痕附着性能的影响

Bonding of Mold Resin to Copper Substrate through an Amorphous Interlayer Film

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