For the build-up substrate interlayer insulating material thermosetting resin composition, resin film, an interlayer insulating material of the film with the product and build-up substrate

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is high heat resistant and of a low expansion coefficient, is excellent in such a peeling strength to the small surface roughness after the roughening as is suitable for a (semi)additive process, and is well balanced among the elastic modulus, breaking strength and breaking extension.;SOLUTION: The thermosetting resin composition containing (a) an epoxy resin, (b) an aromatic amine-based hardener and (c) a solvent-soluble polyamide resin, is characterized by containing (c) the solvent-soluble polyamide resin in an amount of 10 parts by weight or more relative to 100 parts by weight of the sum total amount of (a) the epoxy resin and (b) the aromatic amine-based hardener.;COPYRIGHT: (C)2007,JPO&INPIT