Thermal-Electrical FEA of Localized Heating for MEMS Packaging

摘要

Localized silicon fusion and eutectic bonding for MEMS packaging have been preliminarily investigated through the U.S. Army SBIR Phase I program entitled 'Multi- Power Source for MEMS Packaging', contract No.: W56HZV-05-C- 0092. This methodology allows localized heating at the bonding area without overheating the temperature-sensitive MEMS device. This paper presents the newly developed three-dimensional finite element analysis (FEA) of localized heating for MEMS packaging, for analysis of the electrical problem, thermal problem, and the coupling between the two problems. It was confirmed that high temperature is confined and controllable in the heater-on-circuit localized heating technology.