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Theory and simulation of dopant implantation and diffusion in SiGe

机译:SiGe中掺杂物注入和扩散的理论和模拟

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Strained Si-based technology has imposed a new challenge for understanding dopant implantation and diffusion in SiGe that is often used as the buffer layer for a strained Si cap layer. In this work, we describe our latest modeling effort investigating the difference in dopant implantation and diffusion between Si and SiGe. A lattice expansion theory was developed to account for the volume change due to Ge in Si and its effect on defect formation enthalpy. The theory predicts that As diffusion in SiGe is enhanced by a factor of similar to10, P diffusion by a factor of similar to2, and B diffusion is retarded by a factor of similar to6, when compared to bulk Si. These predictions are consistent with experiment. Dopant profiles for As, P, and B were simulated using process simulators FLOOPS and DIOS. The simulated profiles are in good agreement with experiment. Dopant implantation was simulated using REED-MD. The results showed a noticeable difference in peak and tail positions SiGe compared to Si. (C) 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. [References: 14]
机译:基于应变Si的技术对理解SiGe中的掺杂剂注入和扩散提出了新的挑战,而SiGe通常用作应变Si盖层的缓冲层。在这项工作中,我们描述了我们最新的建模工作,研究了Si和SiGe之间掺杂注入和扩散的差异。提出了一种晶格膨胀理论来解释由于锗在硅中的体积变化及其对缺陷形成焓的影响。该理论预测,与块状Si相比,随着SiGe中Si的扩散增加到大约10倍,P扩散被增加到大约2倍,B扩散被阻止到大约6倍。这些预测与实验一致。使用过程仿真器FLOOPS和DIOS对As,P和B的掺杂分布进行了仿真。模拟轮廓与实验吻合良好。使用REED-MD模拟掺杂剂注入。结果表明,与Si相比,SiGe的峰和尾位置显着不同。 (C)2003 WILEY-VCH Verlag GmbH&Co.KGaA,Weinheim。 [参考:14]

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